Workstations

Supports Intel® Xeon® E-2400 Series Processors PCIe 5.0 Support Dual LAN ports, GbE and dedicated IPMI LAN port 9cm PWM quiet exhaust fan and optioal front intake fan 400W 80PLUS Gold Power Supply

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Quad socket R1 (LGA 2011) supports Intel® Xeon® processor E7-8800 v4/v3, E7-4800 v4/v3 family (up to 24-Core) 2. Up to 6TB DDR3 1600MHz ECC RDIMMs and LRDIMMs; 96x DIMM slots 3. Up to 11x PCI-E 3.0 slots (4 x16, 7 x8)

1. Single socket H4 (LGA 1151) supports Intel® 7th/6th Gen. Core i7/i5/i3 series, Intel® Celeron® and Intel® Pentium® processors 2. 4 Hot-swap 3.5" drive bays, 2 fixed 2.5" drive bays, support total of 5 hard drives 3. 1 PCI-E 3.0 x16 slot, 1 Mini-PCIe with mSATA support, 1 M.2 (M key 2242/2280 PCI-E 3.0 x4)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3008 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

3rd Gen Intel® Xeon® Scalable processor support Intel® C621A Chipset 5 PCI-E 4.0 x16, 1 PCI-E 4.0 x8, 2 NVMe M.2 slots 2x 5.25" peripheral drive bays 4x internal 3.5" SATA rotating drive bays for easy access Compact and quiet operation New front bezel with keylock for added security 1 VGA, 1 COM, 4 USB 3.0 (rear), 2 USB 3.0 (front), 7.1 HD Audio Supports up to two double width active GPUs

1. Single socket P (LGA 3647) supports Intel® Xeon® Phi™ x200 processor, CPU TDP support Up to 260W 2. Intel® C612 chipset 3. Up to 384GB ECC LRDIMM, 192GB ECC RDIMM, DDR4-2400MHz in 6 DIMM slots 4. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 5. 6x 3.5" and 4x 2.5" tool-less drive bays, 2x 5.25" peripheral bays 6. Dual GbE LAN port via Intel® i350 7. Dual cooling zones, 6 fans total 1x 12cm rear exhaust fan 8. 750W Multi-output Power Supply

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. Expansion slots, Single Root Complex, 11 PCI-E 3.0 x16 (FH, FL) slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options