Server

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8, 2 PCIe 5.0 x16, 8 PCIe 5.0 NVMe x4 Internal Port(s)

Single AMD EPYC™ 7003/7002 Series Processor (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Expansion slots: 1 PCI-E 4.0 x32 Left Riser Slot 1 PCI-E 4.0 x16 Right Riser Slot M.2 Interface: 2 SATA/PCI-E 4.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.16 SATA3, 2 M.2, 2 SuperDOM 5.2 NVMe via SlimSAS, 4 NVMe or 16 SATA3 via SlimSAS, 2 M.2, 2 SATA3 6.1 Realtek RTL8211E PHY (dedicated IPMI) 7.ASPEED AST2500 BMC graphics 8.Up to 7 USB 3.0 ports 9.6x 4-pin PWM Fans & Speed control

8th Generation Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium®, Intel® Xeon® E processor (Coffee Lake-S) Server, Intel® Xeon® E processor (Coffee Lake-S) Workstation., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP Intel® C246 Up to 64GB Unbuffered ECC/non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x16 slot), 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1, 2 PCI-Ex16 slots are running at NA/16, or 8/8 1 PCI, 1 - 5V PCI 32bit M.2 Interface: 2 PCI-E 2.0 x4, RAID 0 & 1 M.2 Form Factor: 22110 M.2 Key: M-Key M.2#1~2 are shared with SATA #6~7, M.2#2 is shared with U.2 U.2 Interface: 1 PCI-E 3.0 x4 1 HDMI port, 1 DVI - I port, 1 DP (DisplayPort) port, HDMI is HDMI2.0a, DP is DP1.2, Intel® C246 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Single LAN with Intel® Ethernet Controller I210-AT Single LAN with Intel® PHY I219LM LAN controller Support vPro

1. Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2. 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs 3. Expansion slots: 1 PCI-E 3.0 x32 Left Riser Slot 1 PCI-E 3.0 x16 Right Riser Slot

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs 3 PCIe 5.0 x8, 2 PCIe 5.0 x16

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 4. 1x PCI-E 3.0 x32 Left riser slot 1x PCI-E 3.0 x8 Right riser slot

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot 4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10 2 10GbE LAN ports 10 SATA3 (6Gbps) via C622 I/O: 1 VGA, 2 COM, TPM header 2 SuperDOM with built-in power M.2 NGFF connectorM.2 Interface: PCI-E 3.0 x4 and SATAForm Factor: 2280, 22110Key: M-Key Double Height Connector

1. Single Intel® Core™ i7 900 series 2. LGA1366 socket 3. Intel® X58 Express Chipset 4. 6x 240-pin, DDR3 SDRAM DIMM slots 5. HD ALC883 Audio Controller

1. Intel® C236 chipset 2. Up to 64GB Unbuffered ECC/non-ECC UDIMM DDR4 2400MHz; 4 DIMM slots 3. 3 PCI-E 3.0 x16 (run at 16/NA/16 or 16/8/8), 1 PCI-E 3.0 x1 (in x4), and 1 5V PCI 32-bit slots 4. Single GbE LAN with Intel® i210-AT, Single GbE LAN with Intel® i219LM

CEB (12" x 11") Single Socket SP5 (LGA 6096), supports AMD EPYC™ 9004 (with AMD 3D V-Cache™ Technology) and 97x4 series processors 8 DIMM slots (1DPC), supports DDR5 RDIMM, RDIMM-3DS 1 PCIe5.0 / CXL1.1 x16, 1 PCIe4.0 x16 1 MCIO (PCIe5.0 / CXL1.1 x8 or 8 SATA 6Gb/s), 2 MCIO (PCIe5.0 x8 or 8 SATA 6Gb/s) 4 MCIO (PCIe5.0 x8) Supports 2 M.2 (PCIe5.0 / CXL1.1 x4 or SATA 6Gb/s) Up to 18 SATA 6Gb/s 2 RJ45 (10GbE) by Broadcom BCM57416 1 OCP NIC 3.0 (PCIe5.0 x16) Remote Management (IPMI)

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs 3 PCIe 5.0 x8, 2 PCIe 5.0 x16

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; UPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz; 16 DIMM slots 4. 2 PCI-E 3.0 x16, 4 PCI-E 3.0 x8, and 1 PCI-E 3.0 x4 (in x8) slot 5. Quad 1GbE LAN ports via Intel® i350