Max I/O Systems

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 10 PCI-E 3.0 x8 Low-profile slots, 1 PCI-E 2.0 x4 (in x8) Low-profile slot 4. Intel® i350 Dual port Gigabit Ethernet 5. 16 Hot-swap 2.5" drive bays, 8 SATA3 ports by default; optional drive support: 16 SAS3; 1x 5.25" peripheral drive bay 6. I/O: 1 COM, 1 VGA, 2 USB 3.0 and 2 USB 2.0 (rear) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 4x 8cm 7K RPM, middle fans 9. 1000W Redundant Power Supplies Titanium Level (96%)

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 10x PCI-E 3.0 x8 slots, 1x PCI-E 2.0 x4 (in x8) slot 4. Intel® i350 Dual port Gigabit Ethernet 5. 8x 3.5" Hot-swap drive bays, 2x 5.25" drive bays 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 3x middle fans & 1x rear exhaust fan 8. 980W Redundant Power Supplies Platinum Level (94%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 10x PCI-E 3.0 x8 slots, 1x PCI-E 2.0 x4 (in x8) slot 4. Intel® i350 Dual port Gigabit Ethernet 5. 5x 3.5" Hot-swap HDD Bays 6. 3x 5.25" Peripheral Drive Bays 7. 600W Redundant Power Supplies Platinum Level (94%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 2 PCI-E 3.0 x16 slots, 2 PCI-E 3.0 x16 slots (or 4 PCI-E 3.0 x8), 4 PCI-E 3.0 x8 slots, 1 PCI-E 3.0 x4 (in x8 slot)